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<article article-type="research-article" dtd-version="1.3" xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xml:lang="ru"><front><journal-meta><journal-id journal-id-type="publisher-id">mateltech</journal-id><journal-title-group><journal-title xml:lang="ru">Известия высших учебных заведений. Материалы электронной техники</journal-title><trans-title-group xml:lang="en"><trans-title>Izvestiya Vysshikh Uchebnykh Zavedenii. Materialy Elektronnoi Tekhniki = Materials of Electronics Engineering</trans-title></trans-title-group></journal-title-group><issn pub-type="ppub">1609-3577</issn><issn pub-type="epub">2413-6387</issn><publisher><publisher-name>MISIS</publisher-name></publisher></journal-meta><article-meta><article-id pub-id-type="doi">10.17073/1609-3577-2019-3-202-211</article-id><article-id custom-type="elpub" pub-id-type="custom">mateltech-379</article-id><article-categories><subj-group subj-group-type="heading"><subject>Research Article</subject></subj-group><subj-group subj-group-type="section-heading" xml:lang="ru"><subject>Эпитаксиальные слои и многослойные композиции</subject></subj-group><subj-group subj-group-type="section-heading" xml:lang="en"><subject>EPITAXIAL LAYERS AND MULTILAYERED COMPOSITIONS</subject></subj-group></article-categories><title-group><article-title>Пленки ALD Al2O3, SiNx и SiON в качестве пассивирующих покрытий в AlGaN/GaN HEМТ</article-title><trans-title-group xml:lang="en"><trans-title>ALD Al2O3, SiNx, and SiON films as passivating coatings in AlGaN/GaN HEMT</trans-title></trans-title-group></title-group><contrib-group><contrib contrib-type="author" corresp="yes"><name-alternatives><name name-style="eastern" xml:lang="ru"><surname>Енишерлова</surname><given-names>К. Л.</given-names></name><name name-style="western" xml:lang="en"><surname>Enisherlova</surname><given-names>K. L.</given-names></name></name-alternatives><bio xml:lang="ru"><p>Енишерлова Кира Львовна — доктор техн. наук, начальник лаборатории</p></bio><bio xml:lang="en"/><email xlink:type="simple">enisherlova@pulsarnpp.ru</email><xref ref-type="aff" rid="aff-1"/></contrib><contrib contrib-type="author" corresp="yes"><name-alternatives><name name-style="eastern" xml:lang="ru"><surname>Темпер</surname><given-names>Э. М.</given-names></name><name name-style="western" xml:lang="en"><surname>Temper</surname><given-names>E. M.</given-names></name></name-alternatives><bio xml:lang="ru"><p>Темпер Элла Моисеевна — старший научный сотрудник</p></bio><bio xml:lang="en"><p>Ella M. Temper: Senior Researcher</p><p> </p></bio><xref ref-type="aff" rid="aff-1"/></contrib><contrib contrib-type="author" corresp="yes"><name-alternatives><name name-style="eastern" xml:lang="ru"><surname>Колковский</surname><given-names>Ю. В.</given-names></name><name name-style="western" xml:lang="en"><surname>Kolkovsky</surname><given-names>Yu. V.</given-names></name></name-alternatives><bio xml:lang="ru"><p>Колковский Юрий Владимирович — доктор техн. наук, заместитель генерального директора</p></bio><bio xml:lang="en"><p>Yuri V. Kolkovsky: Dr. Sci. (Eng.), Deputy General Director</p><p> </p></bio><xref ref-type="aff" rid="aff-1"/></contrib><contrib contrib-type="author" corresp="yes"><name-alternatives><name name-style="eastern" xml:lang="ru"><surname>Медведев</surname><given-names>Б. К.</given-names></name><name name-style="western" xml:lang="en"><surname>Medvedev</surname><given-names>B. K.</given-names></name></name-alternatives><bio xml:lang="ru"><p>Медведев Борис Константинович — старший научный сотрудник</p></bio><bio xml:lang="en"><p>Boris K. Medvedev: Senior Researcher</p><p> </p></bio><xref ref-type="aff" rid="aff-1"/></contrib><contrib contrib-type="author" corresp="yes"><name-alternatives><name name-style="eastern" xml:lang="ru"><surname>Капилин</surname><given-names>C. А.</given-names></name><name name-style="western" xml:lang="en"><surname>Kapilin</surname><given-names>S. A.</given-names></name></name-alternatives><bio xml:lang="ru"><p>Капилин Семен Андреевич — инженер</p></bio><bio xml:lang="en"><p>Semen A. Kapilin: Engineer</p><p> </p></bio><xref ref-type="aff" rid="aff-1"/></contrib></contrib-group><aff-alternatives id="aff-1"><aff xml:lang="ru"><institution>АО «НПП «Пульсар»,&#13;
Окружной проезд, д. 27, Москва, 105187, Россия</institution><country>Россия</country></aff><aff xml:lang="en"><institution>JSC “S&amp;PE «Pulsar”,&#13;
27 Okruzhnoy proezd, Moscow 105187, Russia</institution><country>Russian Federation</country></aff></aff-alternatives><pub-date pub-type="collection"><year>2019</year></pub-date><pub-date pub-type="epub"><day>27</day><month>04</month><year>2020</year></pub-date><volume>22</volume><issue>3</issue><fpage>202</fpage><lpage>211</lpage><permissions><copyright-statement>Copyright &amp;#x00A9; Енишерлова К.Л., Темпер Э.М., Колковский Ю.В., Медведев Б.К., Капилин C.А., 2020</copyright-statement><copyright-year>2020</copyright-year><copyright-holder xml:lang="ru">Енишерлова К.Л., Темпер Э.М., Колковский Ю.В., Медведев Б.К., Капилин C.А.</copyright-holder><copyright-holder xml:lang="en">Enisherlova K.L., Temper E.M., Kolkovsky Y.V., Medvedev B.K., Kapilin S.A.</copyright-holder><license xml:lang="ru" license-type="creative-commons-attribution" xlink:href="https://creativecommons.org/licenses/by/4.0/" xlink:type="simple"><license-p>Данная работа распространяется под лицензией Creative Commons Attribution 4.0.</license-p></license><license xml:lang="en" license-type="creative-commons-attribution" xlink:href="https://creativecommons.org/licenses/by/4.0/" xlink:type="simple"><license-p>This work is licensed under a Creative Commons Attribution 4.0 License.</license-p></license></permissions><self-uri xlink:href="https://met.misis.ru/jour/article/view/379">https://met.misis.ru/jour/article/view/379</self-uri><abstract><p>В полевых транзисторах на основе широкозонных нитридных гетероструктур широко используются диэлектрические слои в качестве как одного из основных элементов в активных областях приборов, так и пассивирующих слоев. К диэлектрикам предъявляются жесткие требования по высокой диэлектрической проницаемости, большой ширине запрещенной зоны, сплошности покрытия. Кроме того, пленки должны выдерживать высокие электрические поля и иметь низкую плотность поверхностных состояний на границе диэлектрик/полупроводник. Для этих целей в качестве эффективных покрытий обычно используются низкотемпературные пленки, выращенные с помощью плазмохимического осаждения из газовой фазы, атомно-слоевого осаждения (ALD) и плазменно-стимулированного осаждения. Для гетероструктур AlGaN/GaN наиболее перспективными и чаще всего используемые являются пленки ALD Al2О3, SiNх (Si3N4), SiON, ALD AlN.Исследовано влияние пассивирующих покрытий ALD Al2O3, SiNx и SiON разной толщины на изменение заряда и плотности состояний гетероструктур AlGaN/GaN. Электрофизические параметры структур оценивались с помощью C—V-характеристик, измеренных на разных частотах, и I—V-характеристик. На основании рассмотренных зонных диаграмм структур при разном управляющем напряжении и оценки элементного состава пленок методом Оже-спектроскопии показано, что причиной образования большого положительного заряда при нанесении пленок ALD Al2O3 и SiNx является возникновение дополнительного пьезоэлектрического заряда в буферном слое AlGaN. Показано, что использование пленок SiON с концентрацией кислорода в них более 3 % не приводит к формированию дополнительного положительного заряда, но может вызывать флуктуации тока при измерении I—V-характеристик. Рассмотрен возможный механизм транспорта носителей в области пространственного заряда, приводящий к таким флуктуациям.</p></abstract><trans-abstract xml:lang="en"><p>The effect of passivating ALD Al2O3, SiNx and SiON coatings of different thicknesses on the change in the charge and density of states of AlGaN/GaN heterostructures are studied. The electrophysical parameters of the structures were evaluated using C-V characteristics measured at different frequencies and I-V characteristics. Based on the considered zone diagrams of structures with different control voltages and the evaluation of the elemental composition of the films by Auger spectroscopy, it was shown that the cause of the formation of a large positive charge upon deposition of ALD Al2O3 and SiNx films is the appearance of an additional piezoelectric charge in the AlGaN buffer layer. It is shown that the use of SiON films with an oxygen concentration of more than 3% does not lead to the formation of an additional positive charge, but can cause current fluctuations when measuring I-V characteristics. A possible mechanism of carrier transport in the SCR region, leading to such fluctuations, is considered.</p></trans-abstract><kwd-group xml:lang="ru"><kwd>гетероструктура AlGaN/GaN</kwd><kwd>пассивирующее покрытие</kwd><kwd>фиксированный заряд</kwd><kwd>зонная диаграмма</kwd><kwd>спонтанная и пьезополяризация</kwd><kwd>донорно-подобные центры</kwd><kwd>прыжковая проводимость</kwd><kwd>поверхностные состояния</kwd></kwd-group><kwd-group xml:lang="en"><kwd>AlGaN/GaN heterostructure</kwd><kwd>passivating coating</kwd><kwd>fixed charge</kwd><kwd>band diagram</kwd><kwd>spontaneous and piezoelectric polarization</kwd><kwd>donor-like centers</kwd><kwd>hopping conductivity</kwd><kwd>surface states</kwd></kwd-group></article-meta></front><back><ref-list><title>References</title><ref id="cit1"><label>1</label><citation-alternatives><mixed-citation xml:lang="ru">Chevtchenko S. A., Reshchikov M. A., Fan Q., Ni X., Moon Y. T., Baski A. A., Morkoç H. 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