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<article article-type="research-article" dtd-version="1.3" xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xml:lang="ru"><front><journal-meta><journal-id journal-id-type="publisher-id">mateltech</journal-id><journal-title-group><journal-title xml:lang="ru">Известия высших учебных заведений. Материалы электронной техники</journal-title><trans-title-group xml:lang="en"><trans-title>Izvestiya Vysshikh Uchebnykh Zavedenii. Materialy Elektronnoi Tekhniki = Materials of Electronics Engineering</trans-title></trans-title-group></journal-title-group><issn pub-type="ppub">1609-3577</issn><issn pub-type="epub">2413-6387</issn><publisher><publisher-name>MISIS</publisher-name></publisher></journal-meta><article-meta><article-id pub-id-type="doi">10.17073/1609-3577-2013-3-12-19</article-id><article-id custom-type="elpub" pub-id-type="custom">mateltech-8</article-id><article-categories><subj-group subj-group-type="heading"><subject>Research Article</subject></subj-group><subj-group subj-group-type="section-heading" xml:lang="ru"><subject>Материаловедение и технология. Полупроводники</subject></subj-group><subj-group subj-group-type="section-heading" xml:lang="en"><subject>MATERIALS SCIENCE AND TECHNOLOGY. SEMICONDUCTORS</subject></subj-group></article-categories><title-group><article-title>К ВОЗМОЖНОСТИ ВЫРАЩИВАНИЯ ОБЪЕМНЫХ КРИСТАЛЛОВ Si—Ge МЕТОДОМ ОСЕВОГО ТЕПЛОВОГО ПОТОКА ВБЛИЗИ ФРОНТА КРИСТАЛЛИЗАЦИИ</article-title><trans-title-group xml:lang="en"><trans-title>POSSIBILITY OF GROWING BULK SI—GE CRYSTALS USING AXIAL HEAT FLOW METHOD NEAR THE CRYSTALLIZATION FRONT</trans-title></trans-title-group></title-group><contrib-group><contrib contrib-type="author" corresp="yes"><name-alternatives><name name-style="eastern" xml:lang="ru"><surname>Гоник</surname><given-names>М. И.</given-names></name><name name-style="western" xml:lang="en"><surname>Gonik</surname><given-names>M. A.</given-names></name></name-alternatives><bio xml:lang="ru"><p>кандидат техн. наук, директор, ООО «Центр материаловедения «Фотон», 601655 г. Александров, ул. Ческа Липа, д. 10.</p></bio><xref ref-type="aff" rid="aff-1"/></contrib><contrib contrib-type="author" corresp="yes"><name-alternatives><name name-style="eastern" xml:lang="ru"><surname>Cröll</surname><given-names>Arne</given-names></name><name name-style="western" xml:lang="en"><surname>Cröll</surname><given-names>A.</given-names></name></name-alternatives><bio xml:lang="ru"><p>Prof. Dr., Director of Institute of Geosciences of Albert−Ludwigs−Universität, Hermann−Herder−Str. 5, D−79104 Freiburg, Germany</p></bio><xref ref-type="aff" rid="aff-2"/></contrib></contrib-group><aff-alternatives id="aff-1"><aff xml:lang="ru"><institution>Центр теплофизических исследований «Термо», Центр материаловедения «Фотон»</institution><country>Россия</country></aff><aff xml:lang="en"><institution>Termo Heat Engineering Research Center, Foton Materials Science Center</institution><country>Russian Federation</country></aff></aff-alternatives><aff-alternatives id="aff-2"><aff xml:lang="ru"><institution>Institute of Geosciences of Albert−Ludwigs−Universität, Freiburg, Germany</institution><country>Россия</country></aff><aff xml:lang="en"><institution>Crystallography, Institute of Geosciences of Albert-Ludwigs-Universität</institution><country>Russian Federation</country></aff></aff-alternatives><pub-date pub-type="collection"><year>2013</year></pub-date><pub-date pub-type="epub"><day>13</day><month>03</month><year>2015</year></pub-date><volume>0</volume><issue>3</issue><fpage>12</fpage><lpage>19</lpage><permissions><copyright-statement>Copyright &amp;#x00A9; Гоник М.И., Cröll A., 2015</copyright-statement><copyright-year>2015</copyright-year><copyright-holder xml:lang="ru">Гоник М.И., Cröll A.</copyright-holder><copyright-holder xml:lang="en">Gonik M.A., Cröll A.</copyright-holder><license xml:lang="ru" license-type="creative-commons-attribution" xlink:href="https://creativecommons.org/licenses/by/4.0/" xlink:type="simple"><license-p>Данная работа распространяется под лицензией Creative Commons Attribution 4.0.</license-p></license><license xml:lang="en" license-type="creative-commons-attribution" xlink:href="https://creativecommons.org/licenses/by/4.0/" xlink:type="simple"><license-p>This work is licensed under a Creative Commons Attribution 4.0 License.</license-p></license></permissions><self-uri xlink:href="https://met.misis.ru/jour/article/view/8">https://met.misis.ru/jour/article/view/8</self-uri><abstract><p>Разработан метод бестигельного выращивания монокристаллов кремния и его соединений с германием — метод осевого теплового потока вблизи фронта кристаллизации (ОТФ). Для его реализации использована установка получения кристаллов методом плавающей зоны, в которой дополнительно используется так называемый ОТФ−нагреватель. Нагреватель формирует вокруг себя зону расплава, который удерживается силами поверхностного натяжения между растущим кристаллом, питающим стержнем и нижней и верхней поверхностями ОТФ−нагревателя соответственно. Для защиты графитового корпуса нагревателя от агрессивного действия расплавленного кремния его поверхность покрыта слоем SiC, имеющим специальную нанокристаллическую структуру. Описана система автоматического управления процессом ОТФ−кристаллизации, обеспечивающая поддержание температурного поля вблизи растущего кристалла с точностью 0,05—0,1 К. Проведено численное моделирование тепломассопереноса при росте соединения SixGe1−x, содержащего 2 % Si , а также моделирование формообразования свободной поверхности расплава Si—Ge при вытягивании кристалла. Показана возможность по-лучения однородных по сечению и длине объемных монокристаллов, найден диапазон максимально достижимой высоты слоя расплава, составляющий 10—20 мм, при котором еще сохраняется устойчивость процесса капиллярного формообразования. Выращены легированные сурьмой монокристаллы кремния, характеризующиеся сильным двойникованием, которое непосредственно связано с обнаруженными включениями частиц SiC в кристаллическом кремнии. Подтверждена возможность формирования с помощью ОТФ−нагревателя выпуклой и близкой к плоской формы фронта кристаллизации. Установлено, что при выращивании на затравку в на-правлении [<xref ref-type="bibr" rid="cit111">111</xref>] реализуется послойный механизм роста кремния, причем область гранного роста при определенных условиях занимает почти все сечение кристалла.</p></abstract><trans-abstract xml:lang="en"><p>A technique for crucibleless growth of single−crystal silicon and its alloys with germanium is developed. For this purpose, the setup of floating zone method was used, which was equipped with additional so−called AHP heater. The heater forms around itself a melt zone that is suspended between the growing crystal, the feeding rod and correspondingly the bottom and the top surfaces of the AHP heater by forces of surface tension. To protect the graphite casing of the heater against the aggressive action of molten silicon, the casing surface was coated with SiC having a special nano−crystalline structure. The system of automation control of the AHP crystallization mode is described. It allows controlling the thermal field near the growing crystal with an accuracy of about 0.05−0.1 K. Numerical computations of heat and mass transfer during the solidification of SixGe1−x alloy with a 2% Si content, as well as shaping of the free Si−Ge melt surface during the crystal pulling were performed. Uniform bulk crystals were obtained. The range of the highest melt layer at which the shaping process remains stable was found to be 10−20 mm. The grown As−doped Si single crystals showed to have strong twining directly caused by presence of the SiC inclusions revealed in the crystal bulk. The possibility to achieve a convex and nearly flat shape of the interface by means of the AHP heater was proved. The layered mechanism of Si crystallization was found to be present during crystal growth on a seed in the [<xref ref-type="bibr" rid="cit111">111</xref>] direction, with the faceted area under certain conditions occupying almost the entire crystal cross section.</p></trans-abstract><kwd-group xml:lang="ru"><kwd>установка и метод плавающей зоны</kwd><kwd>погруженный в расплав нагреватель</kwd><kwd>кремний</kwd><kwd>гранный рост</kwd><kwd>линейные и точечные дефекты</kwd></kwd-group><kwd-group xml:lang="en"><kwd>floating zone device and method</kwd><kwd>in−melt heater</kwd><kwd>silicon</kwd><kwd>faceted growth</kwd><kwd>linear and point defects</kwd></kwd-group></article-meta></front><back><ref-list><title>References</title><ref id="cit1"><label>1</label><citation-alternatives><mixed-citation xml:lang="ru">Paul, D. J. Silicon−germanium strained layer materials in microelectronics // D. J. Paul / Adv. 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