Problems of Reliability of Electronic Components

Abstract

This paper describes the problem of increasing the reliability of electronic components (EC) used for the fabrication of high−tech products. Two main ways of solving the problem are considered based on analysis of published data. One approach is Rejection of EC at the input control using special testing methods combined with burn−in test program. This testing reveals components with «hidden defects», counterfeit parts and components with incompatible construction materials both internal and with external service conditions. The other approach considers the feature of creating EC with nanoscale parameters. In this case the modular principle is applied for the design of devices that allows significantly reducing the loads on single elements, and malfunction of a discrete module causes its disconnection from the scheme followed by reconfiguration of the EC structure. We show that in general the problem of increasing reliability is a complex task related to developing an optimum structure of IC elements, informed choice of materials, testing and optimization of circuit solutions.