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Simulation of TiN/HfO2/Pt memristor I–V curve for different conductive filament thickness

https://doi.org/10.17073/1609-3577-2021-2-79-87

Abstract

The operation of the TiN/HfO2/Pt bipolar memristor has been simulated by the finite elements method using the Maxwell steady state equations as a mathematical basis. The simulation provided knowledge of the effect of conductive filament thickness on the shape of the I-V curve. The conductive filament has been considered as the highly conductive Hf ion enriched HfOx phase (x < 2) whose structure is similar to a Magneli phase. In this work a mechanism has been developed describing the formation, growth and dissolution of the HfOx phase in bipolar mode of memristor operation which provides for oxygen vacancy flux control. The conductive filament has a cylindrical shape with the radius varying within 5–10 nm. An increase in the thickness of the conductive filament leads to an increase in the area of the hysteresis loop of the I-V curve due to an increase in the energy output during memristor operation. A model has been developed which allows quantitative calculations and hence can be used for the design of bipolar memristors and assessment of memristor heat loss during operation.

About the Authors

A. N. Aleshin
Institute of Ultra High Frequency Semiconductor Electronics of RAS
Russian Federation

7, Bd 5, Nagorny Proezd, Moscow 117105

Andrey N. Aleshin — Dr. Sci. (Phys.-Math.), Chief Researcher



N. V. Zenchenko
Institute of Ultra High Frequency Semiconductor Electronics of RAS
Russian Federation

7, Bd 5, Nagorny Proezd, Moscow 117105

Nikolay V. Zenchenko — Researcher



O. A. Ruban
Institute of Ultra High Frequency Semiconductor Electronics of RAS
Russian Federation

7, Bd 5, Nagorny Proezd, Moscow 117105

Oleg A. Ruban — Senior Researcher



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Review

For citations:


Aleshin A.N., Zenchenko N.V., Ruban O.A. Simulation of TiN/HfO2/Pt memristor I–V curve for different conductive filament thickness. Izvestiya Vysshikh Uchebnykh Zavedenii. Materialy Elektronnoi Tekhniki = Materials of Electronics Engineering. 2021;24(2):79-87. (In Russ.) https://doi.org/10.17073/1609-3577-2021-2-79-87

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