Calculation of the Kapitza resistance at the silicon - alpha–quartz interface for various temperatures
https://doi.org/10.17073/1609-3577-2021-4-217-221
Abstract
When considering the thermal processes of multilayer nanostructures, a significant part of the energy is dissipated at the boundaries of the layers; to take this factor into account, the Kapitza resistance is used in the simulation. In this study, we calculate the thermal resistance at the Si/SiO2 interface (alpha-quartz) structures for the temperature range up to 567 K. The calculations are carried out based on the acoustic and diffuse mismatch models. The results obtained, in particular, can be used in constructing models of heat transfer in microelectronics.
Supporting agencies: This study was supported by the Russian Foundation for Basic Research, grant No. 19-08-01191A. This study was carried out using the infrastructure of the Center for Collective Use “High-Performance Computing and Big Data” (CCU “Informatics”), Federal Research Center “Computer Science and Control” of the Russian Academy of Sciences (FRC CSC RAS), Moscow.
About the Authors
K. K. Abgaryan
Federal Research Center “Computer Science and Control”
of the Russian Academy of Sciences;
Moscow Aviation Institute (National Research University)
Russian Federation
Russian Federation
44-2 Vavilova Str., Moscow 119333;
4 Volokolamskoe Highway, Moscow 125993
Karine K. Abgaryan — Dr. Sci. (Phys.-Math.), Chief Researcher, Head of Department (1), Head of Department (2)
I. S. Kolbin
Federal Research Center “Computer Science and Control”
of the Russian Academy of Sciences
Russian Federation
Russian Federation
44-2 Vavilova Str., Moscow 119333
Ilya S. Kolbin — Cand. Sci. (Phys.-Math.), Researcher
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Review
For citations:
Abgaryan K.K., Kolbin I.S. Calculation of the Kapitza resistance at the silicon - alpha–quartz interface for various temperatures. Izvestiya Vysshikh Uchebnykh Zavedenii. Materialy Elektronnoi Tekhniki = Materials of Electronics Engineering. 2021;24(4):217-221. (In Russ.) https://doi.org/10.17073/1609-3577-2021-4-217-221
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