Effect of nickel electroplating conditions on the strength of Cu/Ni/Au|AuSn solder joints in the fabrication of high-power semiconductor emitters
https://doi.org/10.17073/1609-3577j.met202509.654
Abstract
The dependence of the strength of a Cu/Ni/Au|AuSn solder joint on the conditions of the galvanic deposition process for the nickel barrier layer is studied. It is shown that when using a succinic acid-based electrolyte, the introduction of poorly soluble nickel succinate into the deposited layer can reduce the strength of the solder joint. The key factor controlling the occurrence of this undesirable process is the pH of the electrolyte. This paper attempts to reconstruct the relationship between solder joint strength and the conditions for the formation of a galvanic Ni barrier layer. Graphs of the peel force versus the pH of the nickel plating electrolyte, changes in electrolyte pH depending on the number of parts processed, and calculated equilibrium concentrations of nickel complexes in the electrolyte that affect the quality of the resulting coating are presented. Using mathematical modeling, an attempt was made to predict the redistribution of nickel complexes when adjusting the electrolyte composition and pH using various methods. The calculated strength results were compared with those obtained in practice. Approaches to mitigating the negative effect of nickel succinate are proposed.
About the Authors
A. N. PetrovaRussian Federation
3-1 Vvedenskogo Str., Moscow 117342
Anna N. Petrova — Head of the Laboratory
A. I. Danilov
Russian Federation
3-1 Vvedenskogo Str., Moscow 117342
Alexander I. Danilov — Head of the Laboratory
A. A. Marmalyuk
Russian Federation
3-1 Vvedenskogo Str., Moscow 117342
Aleksandr A. Marmalyuk — Dr. Sci. (Eng.), Professor
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Review
For citations:
Petrova A.N., Danilov A.I., Marmalyuk A.A. Effect of nickel electroplating conditions on the strength of Cu/Ni/Au|AuSn solder joints in the fabrication of high-power semiconductor emitters. Izvestiya Vysshikh Uchebnykh Zavedenii. Materialy Elektronnoi Tekhniki = Materials of Electronics Engineering. https://doi.org/10.17073/1609-3577j.met202509.654
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