Trimethyl(phenyl)silane — a Precursor for Gas Phase Processes of SiCx : H Film Deposition: Synthesis and Characterization
https://doi.org/10.17073/1609-3577-2014-3-199-205
Abstract
The technique of synthesis and purification of trimethyl(phenyl)silane PhSiMe3, allowing to obtain the product with high yield. Individuality of the product was confirmed by elemental analysis for C, H, Si. IR, UV and 1H NMR–spectroscopic studies, defined its spectral characteristics. Complex thermal analysis and thermogravimetric defined thermoanalytical behavior effects of PhSiMe3 in an inert atmosphere. Tensimetric studies have shown that the compound has sufficient volatility and thermal stability for use as a precursor in the process of chemical vapor deposition (CVD). The composition and temperature limits of the possible crystalline phase complexes in equilibrium with the gas phase of different composition has been determed by method of thermodynamic modeling. Calculated CVD diagrams allow us to select the optimum conditions of film deposition. The possibility of using trimethyl(phenyl)silane in CVD processes for producing dielectric films of hydrogenated silicon carbide has been demonstrated.
About the Authors
E. N. ErmakovaRussian Federation
S. V. Sysoev
Russian Federation
Cand. Sci. (Chem.), Senior Researcher
L. D. Nikulina
Russian Federation
Cand. Sci. (Chem.), Senior Researcher
I. P. Tsyrendorzhieva
Russian Federation
Cand. Sci. (Chem.), Researcher
V. I. Rakhlin
Russian Federation
Dr. Sci. (Chem.), Professor, Chief Researcher
M. L. Kosinova
Russian Federation
Cand. Sci. (Chem.), Head of Laboratory
F. A. Kuznetsov
Russian Federation
References
1. Shoji, Y. Hydrogenated amorphous silicon carbide optical waveguide for telecommunication wavelength applications / Y. Shoji, K. Nakanishi, Y. Sakakibara, K. Kintaka, H. M. Kawashima, M. Mori, T. Kamei // Appl. Phys. Express. − 2010. − V. 3, N 12. − P. 122201.
2. Cech,V.Mechanicalpropertiesofindividuallayersina−SiC : H multilayer film / V. Cech, R. Trivedi, D. Skoda // Plasma Process. Polym. − 2011. − V. 8. − P. 1107—1115.
3. Fanami, T. Electrical characterization of amorphous silicon carbide thin films deposited via polymeric source chemical vapor deposition / T. Fanami, N. Camire, C. Akcik, S. Gujrathi, M. Lessard, Y. Awad, E. Oulachgar, M. Scarlete // Thin Solid Films. − 2008. − V. 516. − P. 3755—3760.
4. Jeong,C.Preparationofborn−dopeda−SiC:Hthinfilmsby ICP−CVD method and to the application of large−area heterojunction solar cells / C. Jeong, Y. B. Kim, S. H. Lee, J. H. Kim // J. Nanosci. Nanotechnol. − 2010. − V. 10. − P. 3321—3325.
5. Wrobel, A. M. Thin a−SiC : H films formed by remote hydrogen microwave plasma CVD using dimethylsilane and trimethylsilane precursors / A. M. Wrobel, A. Walkiewicz−Pietrzykowska, P. Uznanski // Chem. Vap. Deposition. − 2014. − V. 20. − P. 112—117.
6. Wrobel, A. M. a−SiC : H films by remote hydrogen microwave plasma CVD from ethylsilane precursors / A. M. Wrobel, A. Walkiewicz−Pietrzykowska, P. Uznanski, B. Glebocki // Chem. Vap. Deposition. − 2013. − V. 19. − P. 242—250.
7. Wrobel, A. M. Hard a−SiC : H films formed by remote hydrogen microwave plasma chemical vapor deposition using a novel single−source precursor / A. M. Wrobel, A. Walkiewicz−Pietrzykowska, P. Uznanski, B. Glebocki // Thin Solid Films. − 2012. − V. 520. − P. 7100—7108.
8. Jones, A. C. Chemical vapour deposition: precursors, processes and applications / A. C. Jones, M. L. Hitchman. − London : RSC Publishing, 2009. − 582 p.
9. Рахлин, В. И. Характеризация некоторых триметил(органиламино)силанов — предшественников для получения пленок карбонитрида кремния / В. И. Рахлин, И. П. Цырендоржиева, М. Г. Воронков, Л. Д. Никулина, С. В. Сысоев, М. Л. Косинова // Физика и химия стекла. − 2010. − Т. 36, No 3. − С. 463—469.
10. Bellamy, L. J. The infrared spectra of complex molecules. Vol. 2. Advances in infrared group frequencies / L. J. Bellamy − London : Chapman and Hall, 1980. − 299 c.
11. Smith, A. L. Applied infrared spectroscopy fundamentals, techniques and analytical problem−solving / A. L. Smith. − Chichester (UK) : John Wiley and Sons, 1979. − 322 p.
12. Socrates, G. Infrared and raman characteristic group frequencies: tables and charts / G. Socrates. − Chichester ; New York ; Weinheim ; Brisbane ; Singapore ; Toronto : John Wiley and Sons, 2004. − 366 p.
13. Larkin, P. J. Infrared and raman spectroscopy; principles and spectral interpretation / P. J. Larkin. − San−Diego (CA, USA) : Elsevier, 2011. − 230 p.
14. Кузнецов, Ф. А. Фундаментальные основы процессов химического осаждения пленок и структур для наноэлектроники / Ф. А. Кузнецов, М. Г. Воронков, В. О. Борисов, И. К. Игуменов, В. В. Каичев, В. Г. Кеслер, В. В. Кириенко, В. Н. Кичай, М. Л. Косинова, В. В. Кривенцев, М. С. Лебедев, А. В. Лис, Н. Б. Морозова, Л. Д. Никулина, В. И. Рахлин, Ю. М. Румянцев, Т. П. Смирнова, В. С. Суляева, С. В. Сысоев, А. А. Титов, Н. И. Файнер, И. П. Цырендоржиева, Л. И. Чернявский, Л. В. Яковкина. − Новосибирск : Изд−во СО РАН, 2013. − 175 с.
15. Kuznetsov,F.A.Databankofpropertiesofmicroelectronic materials / F. A. Kuznetsov, V. A. Titov, A. A. Titov, L. I. Chernyavskii // Proc. Inter. Symp. on Adv. Mater. − Jap., 1995. − P. 16—32.
16. Термодинамическиесвойстваиндивидуальныхвеществ. − М. : Наука, 1982. − Т. IV, кн. I. − 622 с.
17. Baklanov, M. Advanced Interconnects for ULSI Technology / M. Baklanov, P. S. Ho, E. Zschech (Eds.) − New York : John Wiley andSons,2012.−579p.
18. Wang, T. C. Comparison of characteristics and integration of copper diffusion−barrier dielectrics / T. C. Wang, Y. L. Cheng, Y. L. Wang, T. E. Hsieh, G.J. Hwang, C. F. Chen // Thin Solid Films. − 2006. − V. 498. − P. 36—42.
Review
For citations:
Ermakova E.N., Sysoev S.V., Nikulina L.D., Tsyrendorzhieva I.P., Rakhlin V.I., Kosinova M.L., Kuznetsov F.A. Trimethyl(phenyl)silane — a Precursor for Gas Phase Processes of SiCx : H Film Deposition: Synthesis and Characterization. Izvestiya Vysshikh Uchebnykh Zavedenii. Materialy Elektronnoi Tekhniki = Materials of Electronics Engineering. 2014;(3):199-205. (In Russ.) https://doi.org/10.17073/1609-3577-2014-3-199-205