For citations:
Vaniukhin K.D., Kobeleva S.P., Konzcevoy Yu.A., Kurmatshev V.A., Seidman L.A. Investigation of Sheet Resistance Distribution of Ti, Al, Ni, Cr and Au Metal Films on Silicon Substrates. Izvestiya Vysshikh Uchebnykh Zavedenii. Materialy Elektronnoi Tekhniki = Materials of Electronics Engineering. 2012;(4):33-37. (In Russ.) https://doi.org/10.17073/1609-3577-2012-4-33-37
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