For citations:
Tynyshtykbaev K.B., Ryabikin Yu.A., Tokmoldin S.Zh., Rakhmetov B.A., Aitmukan T. Hydrogen–Induced Cleavage of Silicon Wafers by Electrochemical Etching. Izvestiya Vysshikh Uchebnykh Zavedenii. Materialy Elektronnoi Tekhniki = Materials of Electronics Engineering. 2012;(4):40-44. (In Russ.) https://doi.org/10.17073/1609-3577-2012-4-40-44
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