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Izvestiya Vysshikh Uchebnykh Zavedenii. Materialy Elektronnoi Tekhniki = Materials of Electronics Engineering

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Ivanov K.A., Kaevitser E.V., Zolotarev A.A. Method for calculating a thermal expansion induced mechanical stress in three-dimensional solid-state structures using mathematical modeling. Izvestiya Vysshikh Uchebnykh Zavedenii. Materialy Elektronnoi Tekhniki = Materials of Electronics Engineering. 2023;26(4):309-319. (In Russ.) https://doi.org/10.17073/1609-3577j.met202307.483. EDN: SMVTJB



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ISSN 1609-3577 (Print)
ISSN 2413-6387 (Online)